Thermaltake TG-30 Thermal Heat Sink Compound Paste CL-O023-GROSGM-A

Description

Thermaltake TG-30 Thermal Heat Sink Compound Paste CL-O023-GROSGM-A

TG-30 is a premium thermal compound for high standard cooling performance designed to lower CPU temperatures effectively.

High Thermal Conductivity

The thermal compound contains diamond powder, which would provide a thermal conductivity of 4.5 W/m-k that could fulfill the user’s primary needs.

Easy to Apply

Thermaltake’s specially formulated thermal compound fits perfectly with the honeycomb stencil, which provides an easier way to apply your thermal compound for a neat and well-covered surface that fits all CPUs.

All-In-One Application Kit

This thermal compound application kit includes a set of easily-applied tools for immediate use.

Sustainability and Safety

The high-quality thermal compound provides a longer lifespan of eliminating dry-out or cracking while in use. Non-electrical conductive compound ensures better safety measures for you and your system.

Technical Specification

Thermal Conductivity: 4.5 W/m-k
Density: 2.55 g/cm3
Viscosity: 76 Pa-s
Thermal Impedance: 0.185°C -in2/W
Colour: Grey
Weight: 4g